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Laser upgrade diamond tools to lead the development of microelectronics processing industry
RELEASE TIME:2015-10-21 12:00:17
Patten John, a professor of manufacturing engineering at Western Michigan University in the United States, developed a micro laser assisted processing technology called -LAM, which combines laser and diamond tools, and the silicon semiconductor and ceramic materials for thermal softening and cutting. Patten John said, "these materials are usually very brittle, and if they are trying to make them deformed or processed, they tend to break easily. By softening the material, we can increase the flexibility and make it easier to process."
An infrared optical fiber laser (wavelength range 1000-1500nm) is integrated with a -LAM processing device. Laser beam is irradiated by a single point diamond cutting tool with high optical clarity, and the workpiece material is heated to 600 degrees Celsius. The knifepoint radius for diamond tool of 5 mu m-5mm by epoxy bonding (applicable in milliwatt laser power processing) or welding / brazing (applicable to 1 watt or more laser power processing) way, connected to the laser in a tungsten or tungsten alloy shell.
Other engineering and technical personnel have attempted to use a variety of different methods to process the brittle materials (such as ceramic). One method is to heat the workpiece in the furnace first, and then to process it; another way is to use laser heating and diamond cutting tools. And the method of Patten is integrated with the laser and diamond tools, so it has obvious advantages. He explained, "things get easier, because the laser and the tool itself is aligned, laser heating of the site right in the cutting edge of the cutting edge, so can get the best processing results. In addition, the workpiece material is not excessive heating."
Patten said that the -LAM processing technology can also cut processing time and processing costs, and get a very smooth optical surface. "If you want to make an optical element (such as a mirror), it is usually required to start from the casting of the workpiece, and then a series of processing steps: rough grinding, fine grinding, grinding, in order to eventually form. And our processing method to replace the original series of processes, the Ra1-10nm numerical control machine tool with a single point of cutting, and can also get excellent surface roughness (CNC)."
It is understood that the Patten is working with a Japan Inc, to achieve the commercialization of -LAM system applications. He expected, the invention will be in a number of industries, including automotive, aerospace, medical equipment, semiconductor and optical industry find useless. He said, our initial goal is to aim at the optical and semiconductor industry, but now it seems that most of the application will be in high energy, high temperature microelectronic devices. In the semiconductor industry, silicon wafer is the carrier of the chip and integrated circuit, in which people can use silicon carbide under the condition of high temperature. So now we are all focused on the processing of silicon carbide." 

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